APPMA 2011 Annual Scholarship Submissions due in Februaryby Press Release on 2011-01-25 06:28:19
The Australian Packaging and Processing Machinery Association (APPMA), in conjunction with the Australian Institute of Packaging (AIP), are pleased to announce that submissions are due on Friday the 18th of February for the third annual scholarship program which will enable a packaging engineer the opportunity to complete a Diploma in Packaging Technology.
The 2010 winner was Natalie Quarrell, Packaging and Product Development Officer, Bega Cheese, Strathmerton, Victoria.
The APPMA is Australia’s national organisation, representing the packaging and processing machinery industry. The APPMA are seeking a packaging engineer that is looking to further their education by offering them a scholarship to enrol in the Australian Institute of Packaging Diploma in Packaging Technology.
According to Mr Rob Lawrence, Chairman of the Australian Packaging and Processing Machinery Association, “The annual scholarship enables the awardee to enrol in the Australian Institute of Packaging Diploma in Packaging Technology.”
The Diploma in Packaging Technology is an internationally recognised qualification for those wishing to pursue a career in the packaging industry, or for those who are already in the industry and who wish to extend their knowledge and expertise. The Degree has been offered by the AIP continuously since 1980 and is now offered on-line. The qualification is broad, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes. The Diploma is a degree-level qualification that prepares students to take responsibility for packaging operations at any level through the supply chain.
Pierre Pienaar, FAIP, National President of the AIP, added that the Institute is grateful that associations like the APPMA recognise the importance of education and training and are contributing to the growth of the packaging industry as a whole in Australia.
“The APPMA annual scholarship program is now in its third year and the AIP encourages all packaging engineers to register for the 2011 scholarship,” Mr Pienaar said.
Entries are now available for the APPMA 2011 Scholarship program and can be accessed by emailing email@example.com or visiting www.aipack.com.au and clicking on the scholarship page. Alternatively you can access the submission form on www.appma.com.au
Submissions must be received by Close of Business on Friday the 18th of February with the 2011 winner being announced at AUSPACK PLUS which will be held on the 22nd to the 25th of March at the Melbourne Exhibition & Convention Centre, Victoria.